Telit Cinterion’s ME310M1-W1 module received approval for use on the AT&T LTE-M network. Measuring just 15x18 mm, the ME310M1-W1 is the first cellular Low Power Wide Area (LPWA) module based on the Sony's Altair ALT1350 chipset to be approved by AT&T.
"The Telit Cinterion ME310M1 is an ideal choice for utilizing AT&T's industry-leading LTE-M network," said Cameron Coursey, Vice President, AT&T Connected Solutions. "Whether it is precision agriculture, asset trackers or smart meters, many IoT applications have business models that require zero touch after installation. The ME310M1 meets that requirement and does so while minimizing power usage."
A variety of capabilities make the ME310M1 ideal for smart utility meters, asset tracking, industrial sensors, precision agriculture and other IoT applications whose decade-plus service life exceeds what traditional designs can provide.
These include best-in-class power consumption, flexible SIM technology, short-range radio support, flexibility for multiple location technologies, roadmap for compliance with 3GPP Release 15/ 16/ 17 features, and value-added services and application hosting capabilities.
The ME310M1 also supports all major LTE-M bands, making it the ideal for systems integrators, device OEMs and enterprises that want to rely on the same module for a wide variety of geographic deployments, including worldwide.
"AT&T's certification of the ME310M1 is a milestone for our new portfolio of ultra-compact cellular LPWA modules powered by Sony's Altair ALT1350 chipset," said Jitender Vohra, Sr. Director Carrier Relations, Telit Cinterion. "The Telit Cinterion ME310M1 gives systems integrators, device OEMs and their enterprise customers the confidence that their LPWA IoT applications can always accommodate additional connectivity options, whether it's the latest 3GPP Release 17 NTN protocol or sub-1 GHz unlicensed spectrum."
As a member of the award-winning xE310 family, the ME310M1 has pin-to-pin compatibility with other Telit Cinterion modules, enabling integrators to design a single PCB layout and deploy multiple product variants.
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